With a registered capital of 80 million yuan, the company has strong financial capabilities and is able to provide strong support for the company's research and development, production and operations, market expansion, and more.

The company is located at 538 Xingfu Road, Industrial East District, Xindu District, Chengdu, Sichuan Province, with convenient transportation, which facilitates raw material procurement, product delivery, and client interactions.

Actively participate in various business activities to expand the market. For instance, attend the Xindu District Foreign Trade Supply and Demand Linkage Conference to discuss the development of markets for switchgear, cables, and other products in Africa, the Middle East, and other regions with infrastructure potential. Exchange ideas on product strategies and marketing methods that align with local market demands.

The company is dedicated to the innovation and upgrading of the low-voltage electrical appliances industry. It actively integrates cutting-edge technologies from electrical, information, and computer industries. The company is committed to the research and development of intelligent low-voltage electrical systems. It provides systematic products and solutions to serve mid-to-high-end brands in the electrical industry.

The company holds multiple patents related to bus ducts. For instance, the patent titled "A Bus Duct with Connector and Heat Dissipation Devices" features a main body with multiple heat dissipation devices installed on its inner side, equipped with bus bars on both sides. The heat dissipation devices consist of a heat dissipation frame, heat dissipation strips, corrugated fins, and needle-like fins. The unique structural design enables effective airflow through three ventilation channels, enhancing heat dissipation performance. Another patent, "A Bus Duct with Heat Dissipation Holes on the Housing," utilizes an insulating board, guide wind plates, and wind guide slots in its structural design. Combined with optimized heat dissipation hole layout and integration of heat dissipation blocks, this design efficiently manages heat generated during power transmission, improves heat dissipation efficiency, and extends the service life of the bus duct and insulating materials.

The company holds multiple patents related to bus ducts. For instance, the patent for "A Bus Duct with a Connector and Heat Dissipation Device" features a design with multiple heat dissipation devices inside the bus duct body, equipped with bus bars on both sides. The heat dissipation device consists of a heat dissipation frame, heat dissipation strips, corrugated fins, and needle-like fins. The unique structural design allows internal airflow to circulate effectively through three ventilation channels, enhancing heat dissipation performance. Another patent, "A Bus Duct with a Housing and Heat Dissipation Holes," utilizes the structural design of thermal insulation boards, guide wind boards, and guide wind slots, combined with optimized heat dissipation hole layouts and the integration of heat dissipation blocks. This achieves efficient management of heat during power transmission, improves heat dissipation efficiency, and extends the service life of the bus duct and insulating materials.